Samsung Electronics dze ŋgɔ 39% viɖe ƒe ɖiɖi le Q2 2025 me le AI chip kuxiwo me

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Wobu akɔnta be Samsung Electronics, si nye xexeame katã ƒe kplɔla le nuƒlelawo ƒe elektrɔnikmɔ̃wo kple semiconductors me, akpɔ eƒe ganyawo ƒe ɖiɖi gã aɖe le ƒe 2025 ƒe ɣleti ene evelia me.Numekulawo le mɔ kpɔm be 39% ƒe sia ƒe ƒe ɖiɖi le dɔwɔwɔ me, abu akɔnta be anɔ abe 6.3 trillion ene ($4.62 biliɔn). Esia nye dɔwɔƒea ƒe gakpɔkpɔ si bɔbɔ wu le ƒe ene ade me kple ɣleti etɔ̃ ƒe ɣleti etɔ̃ siwo kplɔ wo nɔewo ɖo ƒe ɖiɖi. Nu vevitɔ si kpe ɖe ɖiɖi sia ŋue nye kuxi siwo Samsung doa goe le Artificial Intelligence (AI) chip ƒe asi me, vevietɔ le ŋkuɖodzinu deŋgɔwo nana asisi veviwo abe Nvidia ene me.

AI chip ƒe asi kple eƒe ŋusẽkpɔɖeamedzi ɖe Samsung dzi .

AI chips ƒe vevienyenye le semiconductor dɔwɔƒea .

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Nunya wɔwɔe va zu mɔ̃ɖaŋununya ƒe ŋgɔyiyi ƒe dzogoedzikpe, si na didi be woawɔ xɔtunu tɔxɛ siwo ate ŋu akpɔ akɔntabubu sesẽwo gbɔ la ƒe didi. High-bandwidth memory (HBM) chips nye nu vevi aɖe le AI dɔwɔɖoɖowo me, vevietɔ le nyatakakadzraɖoƒewo kple AI dɔwɔwɔ ƒe dɔwɔƒewo. Chip siawo naa dɔwɔwɔ kple dɔwɔwɔ nyuie si de ŋgɔ wu, si wɔnɛ be wole vevie na AI ƒe dɔwɔwɔwo.

Samsung ƒe nɔƒe le AI chip ƒe asi me .

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Samsung nye fefewɔla si xɔ aƒe ɖe semiconductor dɔwɔƒea le ŋutinya me. Gake le AI chip ƒe akpaa me la, edze ŋgɔ hoʋiʋli sesẽ si tso hoʋlilawo abe SK Hynix kple Micron mɔ̃ɖaŋununya ene gbɔ. Hoʋlila siawo wɔ AI ƒe chips ƒe didi si le dzidzim ɖe edzi, vevietɔ HBM, si me wokpɔa asitsatsa ƒe akpa gã aɖe le la ŋudɔ nyuie. Samsung ƒe hehe ɖe megbe le HBM chips deŋgɔwo toto vɛ kple wo nana me na be megbedede aɖe va le megbe na hoʋlila siawo.

Kuxiwo le ŋkuɖodzinu deŋgɔwo nana nvidia me .

Hehe ɖe megbe le ɖaseɖigbalẽ kple nuzazãwo ƒe kɔsɔkɔsɔ ƒe nyawo me .

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Samsung ƒe agbagbadzedze be yeatsɔ yeƒe HBM3E 12-high chips yeyetɔwo ana Nvidia la, wotsɔ ɖaseɖigbalẽ nana ƒe ɖoɖo siwo le blewu la xe mɔ nɛ. Numekugbalẽwo gblɔ be anɔ eme be woaɖo wo ɖe Nvidia le ƒe sia me le heheɖemegbe siawo ta. Tsɔ kpe ɖe eŋu la, mɔxexe ɖe China nu yi duta na Samsung ƒe ŋutete gasẽ ɖe edzi be wòakpɔ AI chips ƒe didi si le dzidzim ɖe edzi le nutoa me gbɔ.

Ŋusẽkpɔɖeamedzi ɖe ganyawo ƒe dɔwɔwɔ dzi .

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ŋutete si mele ame si be wòana AI ƒe chip deŋgɔwo na asisi gãwo abe Nvidia ene o la kpɔ ŋusẽ ɖe Samsung ƒe gakpɔkpɔ dzi tẽ. Wole mɔkpɔkpɔ me be semiconductor division, si nye nu vevi aɖe si kpe asi ɖe dɔwɔƒea ƒe viɖekpɔkpɔ ŋu la agblɔ be viɖe si wokpɔ tso dɔwɔnawo me dzi ɖe kpɔtɔ na Q2 2025. Nuwo ƒe ɖiɖi sia ɖe kuxi siwo keke ta wu siwo Samsung doa goe le AI chip ƒe asitsatsa me la fia.

Aɖaŋuɖoɖo ƒe ŋuɖoɖowo kple etsɔme nukpɔsusu .

Habɔbɔ ƒe tɔtrɔ kple susu tsɔtsɔ ɖo AI ŋu .

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Le kuxi siawo ta la, Samsung dze habɔbɔa ƒe tɔtrɔwo gɔme, siwo dometɔ aɖewoe nye ƒuƒoƒo siwo tsɔ wo ɖokui na hena HBM kple chip packaging deŋgɔwo ɖoɖo. Tɔtrɔ sia ƒe taɖodzinue nye be wòana dɔwɔƒea ƒe ŋutetewo nanyo ɖe edzi le AI chip ƒe asi me eye wòakpɔ hoʋiʋli ƒe nyaƒoɖeamenu siwo wòdoa goe gbɔ.

gadede numekuku kple ŋgɔyiyi me .

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Samsung yi edzi le ga geɖe dem numekuku kple ŋgɔyiyi me be woatsɔ awɔ AI chips deŋgɔwo ƒe ŋgɔyiyi kabakaba. Dɔwɔƒea le susu hem yi eƒe HBM ƒe adzɔnuwo ƒe dɔwɔwɔ kple woƒe dɔwɔwɔ nyuie dzi be woakpɔ AI dɔwɔƒea ƒe nuhiahiã siwo le tɔtrɔm gbɔ.

Asitsatsa Ŋuti Ðoɖowo Kple Asi ƒe Ŋusẽkpɔɖeamedziwo Gbɔkpɔkpɔ .

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Samsung hã le dɔ wɔm be yeakpɔ xexeame katã ƒe asitsatsa ŋuti ɖoɖowo ƒe nu sesẽwo, siwo dometɔ aɖewoe nye U.S. ƒe mɔxexe ɖe China ƒe nudɔdɔwo nu. Adzɔha la le mɔnu siwo dzi woato awɔ eƒe nuzazãwo ƒe ɖoɖo vovovowo me dzrom eye wòaɖe ŋuɖoɖo ɖe asi aɖewo koŋ ŋu dzi akpɔtɔ be woaɖe ɖoɖo siawo ƒe ŋusẽkpɔɖeamedzi dzi akpɔtɔ.

Nyanuwuwuw

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Samsung Electronics ƒe viɖe ƒe ɖiɖi 39% le Q2 2025 me te gbe ɖe kuxi siwo dɔwɔƒea doa goe le AI chip ƒe asi si le tɔtrɔm kabakaba me dzi. Togbɔ be dɔwɔƒea le afɔɖeɖe nyuiwo wɔm be yeatsɔ akpɔ nya siawo gbɔe hã la, afɔɖeɖe siawo ƒe dɔwɔwɔ nyuie afia Samsung ƒe ŋutete be wòagaxɔ eƒe nɔƒe le semiconductor dɔwɔƒea. Ame siwo kpɔ gome le eme la anɔ ŋku lém ɖe dɔwɔƒea ƒe ŋgɔyiyi ŋu nyuie le ƒe etɔ̃ siwo gbɔna me be woatsɔ akpɔ eƒe hayahaya ƒe mɔzɔzɔ.

Numekugbalẽwo .

• Samsung Elec Q2 profit likely to drop 39% on weak AI chip sales .
• Samsung Electronics co-CEO Han Jong-hee dies, leaving new appointee in charge .
• Samsung CEO says company will pursue deals as it struggles for growth .
• Samsung chief Jay Y. Lee found not guilty in merger case .
• Samsung's Q2 Outlook Cut: Navigating Trade Crosscurrents in a Tech Tug-of-War .
• Samsung's Missed Opportunity: Weaker Profit Recovery Amid AI Boom .
• Samsung flags chip slowdown as profit drops sharply from previous quarter .
• Samsung Q1 Profit to Drop 21% Due to AI Chip Market Woes .
• Samsung Faces Shareholder Scrutiny After AI Chip Setbacks and Stock Decline .
• Samsung Forecasts 21% Profit Decline in Q1 Amid AI Chip Struggles .
• Samsung Q1 profit to drop 21% on weak AI chip sales, foundry losses By Reuters .
• Samsung Faces Q2 2025 Earnings Shock as Profit Falls 15% - SammyGuru .
• Samsung to face questions from shareholders after AI chip failings, stock price drop .
• Samsung sees Q1 profit beating estimates as looming tariffs spur chip, phone sales .
• Samsung Elec Q2 profit likely to drop 39% on weak AI chip sales | Reuters .

De dzesii: Nusiwo ŋu woƒo nu tsoe le etame la na gɔmesese bubuwo le Samsung Electronics ƒe ganyawo kple aɖaŋuɖoɖowo ŋu.